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Device Electronics for Integrated Circuits by Mansun Chan, Richard S. Muller, Theodore I. Kamins

Device Electronics for Integrated Circuits Mansun Chan, Richard S. Muller, Theodore I. Kamins ebook
Publisher: John Wiley & Sons
ISBN: 0471428779, 9780471428770
Page: 538
Format: djvu

Integrated circuits and other electronic parts have been shrinking in size and growing in complexity and power for decades. (NYSE: A) today announced the latest release of its device modeling software platform, the Integrated Circuit Characterization and Analysis Program (IC-CAP). According to the researchers, the new tool will give both industry and academia a clearer picture of how an electronic device's ability to dissipate heat shrinks with its size, and how materials can be structured at the nanoscale to change their thermal conductivity. A biodegradable integrated circuit—approximately one inch long—is partially The researchers successfully demonstrated the new platform by testing a thermal device designed to monitor and prevent post-surgical infection (demonstrated in a rat model) and also created a 64-pixel digital camera. Device Electronics for Integrated Circuits by Richard S. With IC-CAP 2013.01, Agilent introduces major improvements to its the industry standard compact device model for GaN semiconductor devices. INTEGRATED CIRCUIT ELECTRONICS · Home · About Us electronic circuits and components and then determine whether these emissions are electromagnetic, physical design and device-modeling applications. The medical and environmental promise of dissolving, ultrathin semiconductors packaged in silk. A dissolving semiconductor with drop of water. But as circuits get smaller, it becomes more difficult to dissipate waste heat. GaN technology is becoming commonplace in today's high-power RF communication circuits and automotive electronic components. Read the latest electronic devices news and view electronic devices pictures from our team of local insiders..